半导体激光器外延、芯片及器件产业化工程项目(在建)

半导体激光器外延、芯片及器件产业化工程项目(在建) is in , . 半导体激光器外延、芯片及器件产业化工程项目(在建) is situated nearby to the railway station , as well as near the power station .
Latitude
36.71603° or 36° 42′ 58″ north
Longitude
117.25071° or 117° 15′ 3″ east
Open location code
8P8VP782+C7
Open­Street­Map ID
way 996560604
Open­Street­Map feature
landuse=­construction
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Satellite Map

Discover 半导体激光器外延、芯片及器件产业化工程项目(在建) from above in high-definition satellite imagery.
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